The Advantages And Disadvantages Of Different Packaging Technologies For LED Small Pitch Products And The Future

SMD is short for surface mount device, the bare chip is fixed on the bracket, the metal wire is electrically connected between the positive and negative electrodes, and the epoxy resin is used to protect the SMD LED lamp beads. The LED lamp beads are welded with PCB through reflow welding to form the display unit module, and then the module is installed on the fixed box body. With power supply, control card and wire to form LED display products.

Compared with other packaging situations, the advantages of SMD packaging products outweigh the disadvantages, in line with the characteristics of domestic market demand (decision-making) procurement, use), is also the current industry mainstream products, can quickly get service response.

COB process is directly to the LED chip with conductive or non conductive adhesive are attached to the PCB, basically lead bonding an electrical connection (formal process) or the flip chip technology (without wire) directly connected to the PCB light bead is the cathode (inversion process), the final formation of display unit module, then modules installed on the fixed body,

With power supply, control card and wire to form LED display products.

The advantage of COB technology is that it simplifies the production process, reduces the product cost, reduces the power consumption so that the display surface temperature is reduced and the contrast is greatly improved. The disadvantage is that the reliability is faced with greater challenges, such as the difficulty of lamp repair and the difficulty of consistency of brightness, color and ink color.

IMD is to integrate N groups of RGB lamp beads into a small unit to form a lamp bead.

Main technical route: total positive 4 in 1, total negative 2 in 1, total negative 4 in 1, total negative 6 in 1, etc.

Its advantage is that the advantages of integrated packaging lamp bead size bigger, table more easily, which can realize more smaller spacing, decrease the difficulty of maintaining its drawback is that the industry chain is not perfect, the price is higher, reliability, face greater challenges, maintenance inconvenient, brightness, color, ink consistency has not solved, still need further improvement.

GOB is table module overall surface coated adhesive technology, is in a traditional SMD surface small spacing module encapsulation, a layer of transparent colloid solution is strong and protective, essentially small spacing or SMD products, its advantage is to reduce the death rate of lamp, lamp bead anti knock against additional strength and surface protection, its shortcoming is difficult to repair the lamp, colloid stress result in the module of deformation, reflective,

Local degumming, colloid discoloration, virtual welding is difficult to repair.